Burn Test Socket Product

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Burn-In Test Socket ?

Burn-In Test Process used in Socket

Burn-In Test 공정에서 사용이 되는 S

Burn-In Test Process

Burn-in test socket is product to assure reliability and function of semiconductor, which is used in final process of semicon- ductor to find initial failure of semiconductor SENSATA Technologies Korea is performing designs/applies/sales for all inter- connection products. ENC Tech Company is manufacturing the burn-in test sockets by OEM

OK&NG Package를 구분하여 배출→BIB Socket에 Package 삽입→Burn In Chamber 에 Board 삽입

Burn Test Socket Product

Burn Test Socket Product

CSP Socket component

SLIDER(1), BASE(1), COVER(1), STOPPER(1), LATCH(2), LEAD GUIDE(1), CONTACT, SPRING

SLIDER/BASE/COVER/ADAPTER/LEAD GUIDE/STOPPER/SPRING-I, II/LATCH/CONTACT

Main Customer

  • Domestic : Samsung, SK_Hynix
  • JAPAN : Toshiba, Hitachi
  • U.S.A. : Sandisk, Micron
  • China : NANYA

3D Non-Contact Measurement Instrumen

Smart Scope ZIP 250 sets a high standard in benchtop metrology.
This durable system features fast stage speed for maximum throughput and short cycle times, without sacrificing accuracy. The Smart Scope ZIP 250 is equipped with Measure Mind 3D Multi sensor.
The Critical dimension is as follow;
Contact Height, Open Parameter, Close Parameter, Just add laser, touch probe, or Micro-probing sensors and you ll meas- ure your most complicated parts in a single setup.

비접촉식 3차원 측정 장비/소켓 테스트 장비/자동 핀 삽입기/소켓 교체작업 및 검사