Burn-In Test Socket ?
Burn-In Test Process used in Socket

Burn-In Test Process
Burn-in test socket is product to assure reliability and function of semiconductor, which is used in final process of semicon- ductor to find initial failure of semiconductor SENSATA Technologies Korea is performing designs/applies/sales for all inter- connection products. ENC Tech Company is manufacturing the burn-in test sockets by OEM

Burn Test Socket Product

CSP Socket component
SLIDER(1), BASE(1), COVER(1), STOPPER(1), LATCH(2), LEAD GUIDE(1), CONTACT, SPRING

Main Customer
- Domestic : Samsung, SK_Hynix
- JAPAN : Toshiba, Hitachi
- U.S.A. : Sandisk, Micron
- China : NANYA
3D Non-Contact Measurement Instrumen
Smart Scope ZIP 250 sets a high standard in benchtop metrology.
This durable system features fast stage speed for maximum throughput and short cycle times, without sacrificing accuracy. The Smart Scope ZIP 250 is equipped with Measure Mind 3D Multi sensor.
The Critical dimension is as follow;
Contact Height, Open Parameter, Close Parameter, Just add laser, touch probe, or Micro-probing sensors and you ll meas- ure your most complicated parts in a single setup.
