IC Device Tester

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IC Device Tester(Semiconductor Final Test Equipment) Hot/Cold Chamber for direct test on the memory surface.

Reason for development

Developed the equipment which can test the memory after cool down until -30 degree Celsius. This equipment(patented item) solved moisture problem and the range of application is getting wide.
Based on Mobile Test Chamber, we also developed the equipment which can be applied on state of Graphic Card, On-Board, SSD 16Para, 32Para, 64Para

Type

Hot/Cold Tester(Mobile Device, SSD, USB)

  • As Repeatedly Up/Down the heat on the surface of DRAM, SSD Memory,
    it can be tested in severe condition and helpful to find out main factor of faulty.
    It is easy to analyze the data and automatic save.
  • Period of delivery : 45 working days after P.O

Open/Close Chamber General

  • Controling the temperature and moisture, and artificial intelligence system with less consumption of power.
    Providing optimized environment for various standard test.
  • Period of delivery : 60 working days after P.O

Multi Para Rack Type Chamber(16Para, 32Para, 64Para)

  • It is the multi-solution equipment which can test lots of Memory simultaneously When new device is developed, it can be tested and analyzed with only socket engine produced.
  • Period of delivery : 60 working days after P.O

Graphic Card applied mounting devices/Chamber mounted equipment

  • Directly up/down the heat to NAND FLASH MEMORY of Graphic Card. It is high-level technique equipment as it is closely connected with interface speed,
  • Period of delivery : decided after consultation